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Document 32022R0001R(01)

Corrigendum to Commission Delegated Regulation (EU) 2022/1 of 20 October 2021 amending Regulation (EU) 2021/821 of the European Parliament and of the Council as regards the list of dual-use items (Official Journal of the European Union L 3 of 6 January 2022)

OJ L 20, 31.1.2022, p. 282–282 (BG, ES, CS, DA, DE, ET, EL, EN, FR, GA, HR, IT, LV, LT, HU, MT, NL, PL, PT, RO, SK, SL, FI, SV)

ELI: http://data.europa.eu/eli/reg_del/2022/1/corrigendum/2022-01-31/oj

31.1.2022   

EN

Official Journal of the European Union

L 20/282

Corrigendum to Commission Delegated Regulation (EU) 2022/1 of 20 October 2021 amending Regulation (EU) 2021/821 of the European Parliament and of the Council as regards the list of dual-use items

( Official Journal of the European Union L 3 of 6 January 2022 )

On page 142, in the Annex, point 3B001.f is replaced as follows:

‘f.

Lithography equipment as follows:

1.

Align and expose step and repeat (direct step on wafer) or step and scan (scanner) equipment for wafer processing using photo-optical or X-ray methods and having any of the following:

a.

A light source wavelength shorter than 193 nm; or

b.

Capable of producing a pattern with a 'Minimum Resolvable Feature size' (MRF) of 45 nm or less;

Technical Note:

The 'Minimum Resolvable Feature size' (MRF) is calculated by the following formula:

Image 1

where the K factor = 0,35

2.

Imprint lithography equipment capable of producing features of 45 nm or less;

Note:

3B001.f.2. includes:

—

Micro contact printing tools

—

Hot embossing tools

—

Nano-imprint lithography tools

—

Step and flash imprint lithography (S-FIL) tools

3.

Equipment specially designed for mask making having all of the following:

a.

A deflected focussed electron beam, ion beam or "laser" beam; and

b.

Having any of the following:

1.

A full-width half-maximum (FWHM) spot size smaller than 65 nm and an image placement less than 17 nm (mean + 3 sigma); or

2.

Not used;

3.

A second-layer overlay error of less than 23 nm (mean + 3 sigma) on the mask;

4.

Equipment designed for device processing using direct writing methods, having all of the following:

a.

A deflected focused electron beam; and

b.

Having any of the following:

1.

A minimum beam size equal to or smaller than 15 nm; or

2.

An overlay error less than 27 nm (mean + 3 sigma);’.
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